THE LATEST NEWS
First Annual IC and Distribution Summit Opens in Shenzhen
An international conference exploring the future of China in the global electronics design and manufacturing world opened today in Shenzh...
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Xilinx Details SoC-like FPGAs
Xilinx released the first details of its next-generation Everest architecture, now called Versal. It shows the microprocessor landscape ...
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TSMC Goes Photon to Cloud
TSMC taped out its first chip in a process making limited use of extreme ultraviolet lithography and will start risk production in Apri...
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Startup’s AI Chip Beats GPU
A startup with ties to Amazon is sampling a 16-nm chip mainly targeted for data centers that it claims handily beats CPUs and GPUs f...
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Macronix Plans Low-Cost 3D NAND
Miin Wu believes that he can cut 3D NAND prices by a third. The founder of Macronix is raising funds for a three-year effort that i...
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New Chip Seen Boosting Huawei’s Market Share
Huawei, which hasovertaken Appleto become the new No. 2 in smartphones, is expected to increase its market share with the introduction of...
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