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SK Hynix to Build $3.9 Billion Advanced Packaging Facility in Indiana
SK Hynix, the world’s leading producer of high-bandwidth memory (HBM) used to speed the performance of AI chips, announced it will ...
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MWC 2024 Sets Sights on Global 6G Mission
As the world gathered for Mobile World Congress (MWC) 2024 in Barcelona this week, EE Times returned to Oulu, Finland, to catch...
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Quantum Computing Takes Center Stage at MWC
—Barcelona. At the Mobile World Congress (MWC) 2024 event in Barcelona, Spain, several sessions and a startup competition win hig...
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Arm Updates CSS Designs for Hyperscalers’ Custom Chips
Arm recently upgraded its Arm Neoverse Compute Subsystem (CSS) designs with new CPU cores, aimed at companies building their own ...
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Molex Readies for Growth in Automotive, Medical Markets
CHICAGO—Molex, the world’s third-largest maker of connectors in electronic devices, is preparing for strong growth in automotive, ...
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Intel, Samsung, TSMC ‘Getting Serious’ About CFET
The chip industry’s big three—Intel, Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC)—are “getting serious” about a...
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