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Memory Supply
SANDISK v5.1 TLC 64GB SDINADF4-64G-H
1515.25
SANDISK v5.1 TLC 32GB SDINADF4-32G-H
99.38
SANDISK v5.1 TLC 16GB SDINADF4-16G-H
54.90
SANDISK v5.1 MLC 8GB SDINBDG4-8G
43.65
SANDISK v5.0 MLC 4GB SDIN7DP2-4G
33.00
MICRON MT41K256M16TW-107: P
33.18
MICRON MT41K256M16HA-125:E
32.98
MICRON MT29F2G08ABAEAWP-IT:E
21.69
MICRON MT40A256M16GE-083E:B
43.75
SAMSUNG K4T51163QQ-BCE7
11.00
SAMSUNG KLMBG2JETD-B041
1110.80
SAMSUNG KLMAG1JENB-B041
65.88
SAMSUNG KLM8G1GEME-B041
43.90
SAMSUNG KLM4G1FEPD-B031
32.72
HYNIX H5TQ4G63CFR-RDC
33.15
HYNIX H5TQ2G63GFR-RDC
21.70
HYNIX H5PS1G63KFR-S5C
11.15
HYNIX H27U1G8F2BTR-BC
11.15
NANYA NT5CC512M8EN-EK
33.22
NANYA NT5CB128M16IP-EK
21.80
NANYA NT5CB64M16GP-EK
11.29
NANYA NT5CC64M16GP-DI
11.29
NANYA NT5CB64M16FP-DH
11.26
NANYA NT5TU64M16HG-AC
11.21
NANYA NT5TU32M16FG-AC
11.00
Toshiba THGBMFG7C1LBAIL
65.82
Toshiba THGBMHG6C1LBAIL
43.75
Toshiba THGBMFG6C1LBAIL
43.76
Toshiba THGBMDG5D1LBAIL
32.84
Toshiba TC58NVG1S3HTA00
11.47
TI TPS54160DGQR
11.00
TI TPS62172DSGR
11.00
TI LM2576SX-5.0
11.00
TI CC2530F256RHAR
11.08
TI TPS63031DSKR
11.00
TI LM25118MHX
11.40
TI PCM1794ADBR
44.00
TI TPS63031DSKR
11.00
TI SN65HVD1781DR
11.15
TI ADS1115IDGSR
11.40
TI TPS62172DSG
11.00
samsung K4B4G1646E-BYK0
32.90
samsung K4B4G1646E-BCMA
32.85
samsung K4B4G1646D-BCMA
32.97
samsung K4B4G1646E-BCK0
32.97
samsung K4B2G1646F-BYMA
11.49
samsung K4B2G1646F-BCK0
21.55
samsung K4B2G0846F-BYK0
21.61
samsung K4B1G1646I-BCMA
11.05
samsung K4B1G0846G-BCH9
11.48
molex 522070660
11.00
microchip DSPIC33FJ128GP306A-I/PT
33.10
ADI ADXL327BCPZ-RL7
21.80
microchip MCP6L4T-E/ST
11.00
samsung K4B2G1646F-BYMA
21.57
samsung K4B2G1646F-BYK0
21.57
samsung K4B2G1646F-BCK0
21.60
samsung K4B2G0846F-BYK0
21.85
samsung K4B1G1646I-BCK0
11.12
samsung K4B1G1646I-BCMA
11.08
samsung K9F2G08U0C-SCB0
11.85
NANYA NT5CC256M16DP-DI
13.20
samsung K9F1G08U0E-SCB0
11.13
samsung K4B4G1646E-BCMA
13.03
samsung K4B4G1646E-BYK0
13.02
samsung K4B2G1646F-BYMA
11.53
SANDISK v5.1 TLC 64GB SDINADF4-64G-H
1515.25
SANDISK v5.1 TLC 32GB SDINADF4-32G-H
99.38
SANDISK v5.1 TLC 16GB SDINADF4-16G-H
54.90
SANDISK v5.1 MLC 8GB SDINBDG4-8G
43.65
SANDISK v5.0 MLC 4GB SDIN7DP2-4G
33.00
MICRON MT41K256M16TW-107: P
33.18
MICRON MT41K256M16HA-125:E
32.98
MICRON MT29F2G08ABAEAWP-IT:E
21.69
MICRON MT40A256M16GE-083E:B
43.75
SAMSUNG K4T51163QQ-BCE7
11.00
SAMSUNG KLMBG2JETD-B041
1110.80
SAMSUNG KLMAG1JENB-B041
65.88
SAMSUNG KLM8G1GEME-B041
43.90
SAMSUNG KLM4G1FEPD-B031
32.72
HYNIX H5TQ4G63CFR-RDC
33.15
HYNIX H5TQ2G63GFR-RDC
21.70
HYNIX H5PS1G63KFR-S5C
11.15
HYNIX H27U1G8F2BTR-BC
11.15
NANYA NT5CC512M8EN-EK
33.22
NANYA NT5CB128M16IP-EK
21.80
NANYA NT5CB64M16GP-EK
11.29
NANYA NT5CC64M16GP-DI
11.29
NANYA NT5CB64M16FP-DH
11.26
NANYA NT5TU64M16HG-AC
11.21
NANYA NT5TU32M16FG-AC
11.00
Toshiba THGBMFG7C1LBAIL
65.82
Toshiba THGBMHG6C1LBAIL
43.75
Toshiba THGBMFG6C1LBAIL
43.76
Toshiba THGBMDG5D1LBAIL
32.84
Toshiba TC58NVG1S3HTA00
11.47
TI TPS54160DGQR
11.00
TI TPS62172DSGR
11.00
TI LM2576SX-5.0
11.00
TI CC2530F256RHAR
11.08
TI TPS63031DSKR
11.00
TI LM25118MHX
11.40
TI PCM1794ADBR
44.00
TI TPS63031DSKR
11.00
TI SN65HVD1781DR
11.15
TI ADS1115IDGSR
11.40
TI TPS62172DSG
11.00
samsung K4B4G1646E-BYK0
32.90
samsung K4B4G1646E-BCMA
32.85
samsung K4B4G1646D-BCMA
32.97
samsung K4B4G1646E-BCK0
32.97
samsung K4B2G1646F-BYMA
11.49
samsung K4B2G1646F-BCK0
21.55
samsung K4B2G0846F-BYK0
21.61
samsung K4B1G1646I-BCMA
11.05
samsung K4B1G0846G-BCH9
11.48
molex 522070660
11.00
microchip DSPIC33FJ128GP306A-I/PT
33.10
ADI ADXL327BCPZ-RL7
21.80
microchip MCP6L4T-E/ST
11.00
samsung K4B2G1646F-BYMA
21.57
samsung K4B2G1646F-BYK0
21.57
samsung K4B2G1646F-BCK0
21.60
samsung K4B2G0846F-BYK0
21.85
samsung K4B1G1646I-BCK0
11.12
samsung K4B1G1646I-BCMA
11.08
samsung K9F2G08U0C-SCB0
11.85
NANYA NT5CC256M16DP-DI
13.20
samsung K9F1G08U0E-SCB0
11.13
samsung K4B4G1646E-BCMA
13.03
samsung K4B4G1646E-BYK0
13.02
samsung K4B2G1646F-BYMA
11.53
Hot Offer Parts
microchip MCP6L4T-E/ST
0.2
ADI ADXL327BCPZ-RL7
1.8
microchip DSPIC33FJ128GP306A-I/PT
3.1
molex 522070660
0.13
TI TPS62172DSG
0.4
TI ADS1115IDGSR
1.4
TI SN65HVD1781DR
1.15
TI TPS63031DSKR
0.45
TI PCM1794ADBR
4
TI LM25118MHX
1.4
TI TPS63031DSKR
0.42
TI CC2530F256RHAR
1.08
TI LM2576SX-5.0
0.78
TI TPS62172DSGR
0.38
TI TPS54160DGQR
0.5
microchip MCP6L4T-E/ST
0.2
ADI ADXL327BCPZ-RL7
1.8
microchip DSPIC33FJ128GP306A-I/PT
3.1
molex 522070660
0.13
TI TPS62172DSG
0.4
TI ADS1115IDGSR
1.4
TI SN65HVD1781DR
1.15
TI TPS63031DSKR
0.45
TI PCM1794ADBR
4
TI LM25118MHX
1.4
TI TPS63031DSKR
0.42
TI CC2530F256RHAR
1.08
TI LM2576SX-5.0
0.78
TI TPS62172DSGR
0.38
TI TPS54160DGQR
0.5
THE LATEST NEWS
2023年全球汽车半导体供应商Top10营收排名：英飞凌第1，高通第10
4月15日消息，根据研究机构TechInsights近日报告数据显示，2023年全球汽车半导体市场收入为692亿美元，相比2022年的594亿美元同比增长16.5%。

          
Top5供应商依次为：英飞凌、恩智浦、意法半导体、德州仪器、瑞萨电子，合计占据了50%以上市场份额。
          
其中，英飞凌市场份额为14%，排名第一，恩智浦以10%的市场份额排名第二，意法半导体以9%的市场份额排名第三，德州仪器排名第四，瑞萨电子连续第二年排名第五。
          
此外，安森美、博世、亚德诺、美光、高通，分别排名第六至第十。
          
TechInsights并未详细列出Top10供应商的营收情况，不过，根据高通此前公布2023财年业绩显示，截至2023年9月24日，高通2023财年汽车芯片营收18.72亿美元，同比增长24%。
              
TechInsights还在报告中指出，英飞凌市场份额提高了4个百分点；由于日元走弱趋势，2022年从第三名跌至第五名后，瑞萨电子未能重新夺回前三名的位置；意法半导体凭借其作为领先电力电子供应商的市场地位以及对汽车行业数字化趋势的支持，继续保持强劲增长。
          
根据此前TechInsights（原Strategy Analytics）曾在一份报告中表示，2020年全球汽车半导体Top 10供应商合计占据64.5%份额，预计到2028年，电气化和ADAS将占汽车半导体需求的50%，转化为对功率半导体和先进处理器芯片的需求不断增长，据其图表表示，其中，功率、先进逻辑（MPU/DSP/SoC）、MCU、模拟（线性IC）、传感、存储芯片为主要细分市场。


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