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Memory Supply
SANDISK v5.1 TLC 64GB SDINADF4-64G-H
1515.25
SANDISK v5.1 TLC 32GB SDINADF4-32G-H
99.38
SANDISK v5.1 TLC 16GB SDINADF4-16G-H
54.90
SANDISK v5.1 MLC 8GB SDINBDG4-8G
43.65
SANDISK v5.0 MLC 4GB SDIN7DP2-4G
33.00
MICRON MT41K256M16TW-107: P
33.18
MICRON MT41K256M16HA-125:E
32.98
MICRON MT29F2G08ABAEAWP-IT:E
21.69
MICRON MT40A256M16GE-083E:B
43.75
SAMSUNG K4T51163QQ-BCE7
11.00
SAMSUNG KLMBG2JETD-B041
1110.80
SAMSUNG KLMAG1JENB-B041
65.88
SAMSUNG KLM8G1GEME-B041
43.90
SAMSUNG KLM4G1FEPD-B031
32.72
HYNIX H5TQ4G63CFR-RDC
33.15
HYNIX H5TQ2G63GFR-RDC
21.70
HYNIX H5PS1G63KFR-S5C
11.15
HYNIX H27U1G8F2BTR-BC
11.15
NANYA NT5CC512M8EN-EK
33.22
NANYA NT5CB128M16IP-EK
21.80
NANYA NT5CB64M16GP-EK
11.29
NANYA NT5CC64M16GP-DI
11.29
NANYA NT5CB64M16FP-DH
11.26
NANYA NT5TU64M16HG-AC
11.21
NANYA NT5TU32M16FG-AC
11.00
Toshiba THGBMFG7C1LBAIL
65.82
Toshiba THGBMHG6C1LBAIL
43.75
Toshiba THGBMFG6C1LBAIL
43.76
Toshiba THGBMDG5D1LBAIL
32.84
Toshiba TC58NVG1S3HTA00
11.47
TI TPS54160DGQR
11.00
TI TPS62172DSGR
11.00
TI LM2576SX-5.0
11.00
TI CC2530F256RHAR
11.08
TI TPS63031DSKR
11.00
TI LM25118MHX
11.40
TI PCM1794ADBR
44.00
TI TPS63031DSKR
11.00
TI SN65HVD1781DR
11.15
TI ADS1115IDGSR
11.40
TI TPS62172DSG
11.00
samsung K4B4G1646E-BYK0
32.90
samsung K4B4G1646E-BCMA
32.85
samsung K4B4G1646D-BCMA
32.97
samsung K4B4G1646E-BCK0
32.97
samsung K4B2G1646F-BYMA
11.49
samsung K4B2G1646F-BCK0
21.55
samsung K4B2G0846F-BYK0
21.61
samsung K4B1G1646I-BCMA
11.05
samsung K4B1G0846G-BCH9
11.48
molex 522070660
11.00
microchip DSPIC33FJ128GP306A-I/PT
33.10
ADI ADXL327BCPZ-RL7
21.80
microchip MCP6L4T-E/ST
11.00
samsung K4B2G1646F-BYMA
21.57
samsung K4B2G1646F-BYK0
21.57
samsung K4B2G1646F-BCK0
21.60
samsung K4B2G0846F-BYK0
21.85
samsung K4B1G1646I-BCK0
11.12
samsung K4B1G1646I-BCMA
11.08
samsung K9F2G08U0C-SCB0
11.85
NANYA NT5CC256M16DP-DI
13.20
samsung K9F1G08U0E-SCB0
11.13
samsung K4B4G1646E-BCMA
13.03
samsung K4B4G1646E-BYK0
13.02
samsung K4B2G1646F-BYMA
11.53
SANDISK v5.1 TLC 64GB SDINADF4-64G-H
1515.25
SANDISK v5.1 TLC 32GB SDINADF4-32G-H
99.38
SANDISK v5.1 TLC 16GB SDINADF4-16G-H
54.90
SANDISK v5.1 MLC 8GB SDINBDG4-8G
43.65
SANDISK v5.0 MLC 4GB SDIN7DP2-4G
33.00
MICRON MT41K256M16TW-107: P
33.18
MICRON MT41K256M16HA-125:E
32.98
MICRON MT29F2G08ABAEAWP-IT:E
21.69
MICRON MT40A256M16GE-083E:B
43.75
SAMSUNG K4T51163QQ-BCE7
11.00
SAMSUNG KLMBG2JETD-B041
1110.80
SAMSUNG KLMAG1JENB-B041
65.88
SAMSUNG KLM8G1GEME-B041
43.90
SAMSUNG KLM4G1FEPD-B031
32.72
HYNIX H5TQ4G63CFR-RDC
33.15
HYNIX H5TQ2G63GFR-RDC
21.70
HYNIX H5PS1G63KFR-S5C
11.15
HYNIX H27U1G8F2BTR-BC
11.15
NANYA NT5CC512M8EN-EK
33.22
NANYA NT5CB128M16IP-EK
21.80
NANYA NT5CB64M16GP-EK
11.29
NANYA NT5CC64M16GP-DI
11.29
NANYA NT5CB64M16FP-DH
11.26
NANYA NT5TU64M16HG-AC
11.21
NANYA NT5TU32M16FG-AC
11.00
Toshiba THGBMFG7C1LBAIL
65.82
Toshiba THGBMHG6C1LBAIL
43.75
Toshiba THGBMFG6C1LBAIL
43.76
Toshiba THGBMDG5D1LBAIL
32.84
Toshiba TC58NVG1S3HTA00
11.47
TI TPS54160DGQR
11.00
TI TPS62172DSGR
11.00
TI LM2576SX-5.0
11.00
TI CC2530F256RHAR
11.08
TI TPS63031DSKR
11.00
TI LM25118MHX
11.40
TI PCM1794ADBR
44.00
TI TPS63031DSKR
11.00
TI SN65HVD1781DR
11.15
TI ADS1115IDGSR
11.40
TI TPS62172DSG
11.00
samsung K4B4G1646E-BYK0
32.90
samsung K4B4G1646E-BCMA
32.85
samsung K4B4G1646D-BCMA
32.97
samsung K4B4G1646E-BCK0
32.97
samsung K4B2G1646F-BYMA
11.49
samsung K4B2G1646F-BCK0
21.55
samsung K4B2G0846F-BYK0
21.61
samsung K4B1G1646I-BCMA
11.05
samsung K4B1G0846G-BCH9
11.48
molex 522070660
11.00
microchip DSPIC33FJ128GP306A-I/PT
33.10
ADI ADXL327BCPZ-RL7
21.80
microchip MCP6L4T-E/ST
11.00
samsung K4B2G1646F-BYMA
21.57
samsung K4B2G1646F-BYK0
21.57
samsung K4B2G1646F-BCK0
21.60
samsung K4B2G0846F-BYK0
21.85
samsung K4B1G1646I-BCK0
11.12
samsung K4B1G1646I-BCMA
11.08
samsung K9F2G08U0C-SCB0
11.85
NANYA NT5CC256M16DP-DI
13.20
samsung K9F1G08U0E-SCB0
11.13
samsung K4B4G1646E-BCMA
13.03
samsung K4B4G1646E-BYK0
13.02
samsung K4B2G1646F-BYMA
11.53
Hot Offer Parts
microchip MCP6L4T-E/ST
0.2
ADI ADXL327BCPZ-RL7
1.8
microchip DSPIC33FJ128GP306A-I/PT
3.1
molex 522070660
0.13
TI TPS62172DSG
0.4
TI ADS1115IDGSR
1.4
TI SN65HVD1781DR
1.15
TI TPS63031DSKR
0.45
TI PCM1794ADBR
4
TI LM25118MHX
1.4
TI TPS63031DSKR
0.42
TI CC2530F256RHAR
1.08
TI LM2576SX-5.0
0.78
TI TPS62172DSGR
0.38
TI TPS54160DGQR
0.5
microchip MCP6L4T-E/ST
0.2
ADI ADXL327BCPZ-RL7
1.8
microchip DSPIC33FJ128GP306A-I/PT
3.1
molex 522070660
0.13
TI TPS62172DSG
0.4
TI ADS1115IDGSR
1.4
TI SN65HVD1781DR
1.15
TI TPS63031DSKR
0.45
TI PCM1794ADBR
4
TI LM25118MHX
1.4
TI TPS63031DSKR
0.42
TI CC2530F256RHAR
1.08
TI LM2576SX-5.0
0.78
TI TPS62172DSGR
0.38
TI TPS54160DGQR
0.5
THE LATEST NEWS
2023年国内芯片制造设备进口额同比增长14%
海关总署发布的数据显示，2023年，我国芯片制造设备的进口额为2805亿元（396亿美元），同比增长14%。          

从数据中可以看到，自2015年至今，我国在芯片制造设备上的投入整体呈波动上升趋势，2023年的进口额约为2015年进口额的35倍。          
近年来，在连番的芯片限制之下，我国芯片设备进口额明显增长，因为相关企业加大了投资力度，以求能实现芯片的自给自足，推动国内半导体产业发展。          
在美新的出口限制措施于2023年9月1日生效之前，我国进口的芯片设备量飙升，远超此前任何一年的数据。由于荷兰光刻机厂商ASML占据了全球光刻机市场约八成的份额，因此，这一数据的增长主要体现在从荷兰处进口额的增长，2023年12月，我国对荷兰光刻设备的进口额达11亿美元，同比增长近1000%。              
1月17日，国家统计局公布的数据显示，2023年我国集成电路的产量为3514亿块，同比2022年增长了6.9%；其中，2023年12月的产量为362亿块，同比增长34.0%。统计数据涵盖了逻辑芯片、存储芯片、模拟芯片和专用芯片，以及传感器和芯片模块。        
与此同时，2023年我国集成电路出口量为2678亿块，同比减少1.8%；进口量为4795亿块，同比减少10.8%。          
这意味着，国内半导体产业已积极进入国产化进程。              

 

 

目前国内在高端芯片方面的制造能力还比较弱，不过，已经有越来越多的目光转向了半导体制造设备，以实现更完全的自主。


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