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Memory Supply
SANDISK v5.1 TLC 64GB SDINADF4-64G-H
1515.25
SANDISK v5.1 TLC 32GB SDINADF4-32G-H
99.38
SANDISK v5.1 TLC 16GB SDINADF4-16G-H
54.90
SANDISK v5.1 MLC 8GB SDINBDG4-8G
43.65
SANDISK v5.0 MLC 4GB SDIN7DP2-4G
33.00
MICRON MT41K256M16TW-107: P
33.18
MICRON MT41K256M16HA-125:E
32.98
MICRON MT29F2G08ABAEAWP-IT:E
21.69
MICRON MT40A256M16GE-083E:B
43.75
SAMSUNG K4T51163QQ-BCE7
11.00
SAMSUNG KLMBG2JETD-B041
1110.80
SAMSUNG KLMAG1JENB-B041
65.88
SAMSUNG KLM8G1GEME-B041
43.90
SAMSUNG KLM4G1FEPD-B031
32.72
HYNIX H5TQ4G63CFR-RDC
33.15
HYNIX H5TQ2G63GFR-RDC
21.70
HYNIX H5PS1G63KFR-S5C
11.15
HYNIX H27U1G8F2BTR-BC
11.15
NANYA NT5CC512M8EN-EK
33.22
NANYA NT5CB128M16IP-EK
21.80
NANYA NT5CB64M16GP-EK
11.29
NANYA NT5CC64M16GP-DI
11.29
NANYA NT5CB64M16FP-DH
11.26
NANYA NT5TU64M16HG-AC
11.21
NANYA NT5TU32M16FG-AC
11.00
Toshiba THGBMFG7C1LBAIL
65.82
Toshiba THGBMHG6C1LBAIL
43.75
Toshiba THGBMFG6C1LBAIL
43.76
Toshiba THGBMDG5D1LBAIL
32.84
Toshiba TC58NVG1S3HTA00
11.47
TI TPS54160DGQR
11.00
TI TPS62172DSGR
11.00
TI LM2576SX-5.0
11.00
TI CC2530F256RHAR
11.08
TI TPS63031DSKR
11.00
TI LM25118MHX
11.40
TI PCM1794ADBR
44.00
TI TPS63031DSKR
11.00
TI SN65HVD1781DR
11.15
TI ADS1115IDGSR
11.40
TI TPS62172DSG
11.00
samsung K4B4G1646E-BYK0
32.90
samsung K4B4G1646E-BCMA
32.85
samsung K4B4G1646D-BCMA
32.97
samsung K4B4G1646E-BCK0
32.97
samsung K4B2G1646F-BYMA
11.49
samsung K4B2G1646F-BCK0
21.55
samsung K4B2G0846F-BYK0
21.61
samsung K4B1G1646I-BCMA
11.05
samsung K4B1G0846G-BCH9
11.48
molex 522070660
11.00
microchip DSPIC33FJ128GP306A-I/PT
33.10
ADI ADXL327BCPZ-RL7
21.80
microchip MCP6L4T-E/ST
11.00
samsung K4B2G1646F-BYMA
21.57
samsung K4B2G1646F-BYK0
21.57
samsung K4B2G1646F-BCK0
21.60
samsung K4B2G0846F-BYK0
21.85
samsung K4B1G1646I-BCK0
11.12
samsung K4B1G1646I-BCMA
11.08
samsung K9F2G08U0C-SCB0
11.85
NANYA NT5CC256M16DP-DI
13.20
samsung K9F1G08U0E-SCB0
11.13
samsung K4B4G1646E-BCMA
13.03
samsung K4B4G1646E-BYK0
13.02
samsung K4B2G1646F-BYMA
11.53
SANDISK v5.1 TLC 64GB SDINADF4-64G-H
1515.25
SANDISK v5.1 TLC 32GB SDINADF4-32G-H
99.38
SANDISK v5.1 TLC 16GB SDINADF4-16G-H
54.90
SANDISK v5.1 MLC 8GB SDINBDG4-8G
43.65
SANDISK v5.0 MLC 4GB SDIN7DP2-4G
33.00
MICRON MT41K256M16TW-107: P
33.18
MICRON MT41K256M16HA-125:E
32.98
MICRON MT29F2G08ABAEAWP-IT:E
21.69
MICRON MT40A256M16GE-083E:B
43.75
SAMSUNG K4T51163QQ-BCE7
11.00
SAMSUNG KLMBG2JETD-B041
1110.80
SAMSUNG KLMAG1JENB-B041
65.88
SAMSUNG KLM8G1GEME-B041
43.90
SAMSUNG KLM4G1FEPD-B031
32.72
HYNIX H5TQ4G63CFR-RDC
33.15
HYNIX H5TQ2G63GFR-RDC
21.70
HYNIX H5PS1G63KFR-S5C
11.15
HYNIX H27U1G8F2BTR-BC
11.15
NANYA NT5CC512M8EN-EK
33.22
NANYA NT5CB128M16IP-EK
21.80
NANYA NT5CB64M16GP-EK
11.29
NANYA NT5CC64M16GP-DI
11.29
NANYA NT5CB64M16FP-DH
11.26
NANYA NT5TU64M16HG-AC
11.21
NANYA NT5TU32M16FG-AC
11.00
Toshiba THGBMFG7C1LBAIL
65.82
Toshiba THGBMHG6C1LBAIL
43.75
Toshiba THGBMFG6C1LBAIL
43.76
Toshiba THGBMDG5D1LBAIL
32.84
Toshiba TC58NVG1S3HTA00
11.47
TI TPS54160DGQR
11.00
TI TPS62172DSGR
11.00
TI LM2576SX-5.0
11.00
TI CC2530F256RHAR
11.08
TI TPS63031DSKR
11.00
TI LM25118MHX
11.40
TI PCM1794ADBR
44.00
TI TPS63031DSKR
11.00
TI SN65HVD1781DR
11.15
TI ADS1115IDGSR
11.40
TI TPS62172DSG
11.00
samsung K4B4G1646E-BYK0
32.90
samsung K4B4G1646E-BCMA
32.85
samsung K4B4G1646D-BCMA
32.97
samsung K4B4G1646E-BCK0
32.97
samsung K4B2G1646F-BYMA
11.49
samsung K4B2G1646F-BCK0
21.55
samsung K4B2G0846F-BYK0
21.61
samsung K4B1G1646I-BCMA
11.05
samsung K4B1G0846G-BCH9
11.48
molex 522070660
11.00
microchip DSPIC33FJ128GP306A-I/PT
33.10
ADI ADXL327BCPZ-RL7
21.80
microchip MCP6L4T-E/ST
11.00
samsung K4B2G1646F-BYMA
21.57
samsung K4B2G1646F-BYK0
21.57
samsung K4B2G1646F-BCK0
21.60
samsung K4B2G0846F-BYK0
21.85
samsung K4B1G1646I-BCK0
11.12
samsung K4B1G1646I-BCMA
11.08
samsung K9F2G08U0C-SCB0
11.85
NANYA NT5CC256M16DP-DI
13.20
samsung K9F1G08U0E-SCB0
11.13
samsung K4B4G1646E-BCMA
13.03
samsung K4B4G1646E-BYK0
13.02
samsung K4B2G1646F-BYMA
11.53
Hot Offer Parts
microchip MCP6L4T-E/ST
0.2
ADI ADXL327BCPZ-RL7
1.8
microchip DSPIC33FJ128GP306A-I/PT
3.1
molex 522070660
0.13
TI TPS62172DSG
0.4
TI ADS1115IDGSR
1.4
TI SN65HVD1781DR
1.15
TI TPS63031DSKR
0.45
TI PCM1794ADBR
4
TI LM25118MHX
1.4
TI TPS63031DSKR
0.42
TI CC2530F256RHAR
1.08
TI LM2576SX-5.0
0.78
TI TPS62172DSGR
0.38
TI TPS54160DGQR
0.5
microchip MCP6L4T-E/ST
0.2
ADI ADXL327BCPZ-RL7
1.8
microchip DSPIC33FJ128GP306A-I/PT
3.1
molex 522070660
0.13
TI TPS62172DSG
0.4
TI ADS1115IDGSR
1.4
TI SN65HVD1781DR
1.15
TI TPS63031DSKR
0.45
TI PCM1794ADBR
4
TI LM25118MHX
1.4
TI TPS63031DSKR
0.42
TI CC2530F256RHAR
1.08
TI LM2576SX-5.0
0.78
TI TPS62172DSGR
0.38
TI TPS54160DGQR
0.5
THE LATEST NEWS
消息称台积电正考虑在日本建第二座芯片工厂，预计投资超一万亿日元

台积电目前在熊本设立的首家工厂现已动工，目标 2024 年投产。该厂由熊本县晶圆代工服务子公司 Japan Advanced Semiconductor Manufacturing（JASM）负责营运，索尼旗下半导体解决方案公司及丰田汽车集团企业、Denso 皆有投资。

报道指出，台积电似乎正就政府补贴和客户投资等问题谈判，将在年底前敲定细节。日本政府已将确保半导体的稳定供应作为重要的经济安全问题。

此外，台积电 CEO 魏哲家在 1 月份的财务业绩会议上也曾表示，该公司正在考虑在日本建设第二家工厂。但索尼方面表示没有与台积电讨论在相关事宜。


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